Infrared Reflow Soldering Technology.

Nitrogen in IR Reflow Soldering

Reflow Soldering Guidelines for Surface - Mount Devices

Reflow Soldering Process Considerations for Surface Mount Application

Modelling the self-alignment of passive chip components during reflow soldering

In my research a 3D model was created to investigate the restoring force arising and the self-alignment occurring during reflow soldering; and simulations were performed to examine the assumptions given by the model. Besides, experiments were carried out to verify both the assumptions and the simulation predictions. Passive components with the size of 0603 (1.5 x 0.75 mm) were placed with inten...

Cross-interaction of Interfacial Reactions in Ni (au/ni/cu)-snag-cu Solder Joints during Reflow Soldering and Thermal Aging

The coupling effect of interfacial reactions between two pads in Ni-SnAg-Cu and Au/Ni/Cu-SnAg-Cu solder joints was investigated in this paper. After reflow soldering, a large amount of Cu can diffuse across the solder joint to the opposite pad to form (Cu,Ni)6Sn5 IMC on the Ni pad in Ni-SnAg-Cu solder joint. A little Ni can also be detected in Cu6Sn5 layer, which contains some trapped solder, o...